OPTEK Technology Inc. 1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 visibleLED@optekinc.com www.optekinc.com
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
Issue B 05/2011
Page 7 of 7
T-1?High-Intensity LED
OVLG x0CyB9 Series
Symbol
Test Conditions
Criteria for Judgment
Min.
Max
Luminous Intensity
I
V
I
F
= 20mA
LSLx0.7 **
Forward Voltage
V
F
I
F
= 20mA
USLx1.1 *
Test Item
2. Failure Criteria (T
A
= 25癈):
( * ) USL: Upper Standard Level, ( ** ) LSL: Lower Standard Level
Reliability Test
LED lamps are checked by reliability tests based on MIL standards.
1. Test Conditions, Acceptable Criteria & Results
Classifi-
cation
Test Item
Std. Test
Method
Test Conditions
Duration
Unit
Acc / Rej
Criteria
Result
Life Test
Operation Life
Test (OLT)
MIL-STD-750D
Method 1026.3
T
A
=25癈 , I
F
=30mA *
1000 Hrs 100 0 / 1 Pass
High Temperature
Storage (HTS)
MIL-STD-750D
Method 1032.1
T
A
=100癈
1000 Hrs 100 0 / 1 Pass
Low Temperature
Storage (LTS)
MIL-STD-750D
Method 1032.1
T
A
=40癈
1000 Hrs 100 0 / 1 Pass
Temp. & Humidity
with Bias (THB)
MIL-STD-750D
Method 103B
T
A
=85癈 , Rh=85%
I
F
=20mA
500 Hrs 100 0 / 1 Pass
Thermal Shock
Test (TST)
MIL-STD-750D
Method 1056.1
0癈 ~ 100癈
2min 2min
100 cycles 100 0 / 1 Pass
Temperature Cy-
cling Test (TCT)
MIL-STD-750D
Method 1051.5
-40癈 ~ 25癈 ~ 100癈 ~ 25癈
30min 5min 30min 5min
100 cycles 100 0 / 1 Pass
Solderability
MIL-STD-750D
Method 2026.4
235?癈 , 5 sec.
1 time 20 0 / 1 Pass
Resistance to
Soldering Heat
MIL-STD-750D
Method 2031.1
260?癈 , 5 sec.
1 time 20 0 / 1 Pass
Lead Integrity MIL-STD-750D
Method 2036.3
Load 2.5N (0.25kgf)
0皛90皛0? , bend
3 times 20 0 / 1 Pass
Remark: ( * ) I
F
= 30mA for AllnGaP chip; I
F
= 20mA for InGan chip
( ** ) I
F
= 20mA for AllnGaP chip; I
F
= 10mA for InGan chip
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